ENIG is one of final surface treatment processes for PCB for depositing a layer of nickel and gold on copper surface; ENIG belongs to medium phosphorus and medium~high phosphorus series, and has excellent solderability, corrosion and wear resistance, and is an ideal process designed in particular for final surface of PCB.

Applicable to the manufacturing of fine circuits;

High corrosion resistance;

No gold peel off upon OSP micro etch for 5 times;

Excellent solderability.